Odisha Unveils India's First 3D Semiconductor Packaging Plant

Key Points

• India's first 3D semiconductor packaging plant inaugurated in Bhubaneswar, Odisha
• Investment of ₹1,943.53 crore to produce 70,000 glass panels annually
• Expected to create 2,500 jobs and strengthen AI, defence, and telecom supply chains
• Part of India's broader strategy for semiconductor self-reliance

Full Details

The foundation stone for India's inaugural 3D semiconductor packaging unit was laid in Bhubaneswar by Odisha Chief Minister Mohan Charan Majhi and Union IT Minister Ashwini Vaishnaw. Backed by an investment of roughly ₹1,943.53 crore, the plant will produce about 70,000 glass panels a year and is expected to create around 2,500 jobs. This project is positioned as a cornerstone for India's self-reliance strategy, aiming to strengthen supply chains for artificial intelligence, defence, and telecommunications applications. The development marks a major step toward expanding India's semiconductor value chain and reducing dependence on foreign manufacturing, reflecting Odisha's transition into a technology-driven economy.