Odisha Unveils India's First 3D Semiconductor Packaging Plant
Odisha has launched India's first advanced 3D semiconductor packaging facility in Bhubaneswar, a Rs 1,943.53 crore project expected to produce 70,000 glass panels annually and create 2,500 jobs.
Key Points
- India's first 3D semiconductor packaging plant launched in Bhubaneswar, Odisha.
- Rs 1,943.53 crore investment to produce 70,000 glass panels annually and create 2,500 jobs.
- Aims to support AI, defense, and telecommunications sectors, boosting self-reliance.
Full Details
The foundation stone for India's first advanced 3D semiconductor packaging unit was laid in Bhubaneswar by Odisha Chief Minister Mohan Charan Majhi and Union IT Minister Ashwini Vaishnaw. This Rs 1,943.53 crore facility is designed to produce 70,000 glass panels per year and will generate approximately 2,500 jobs, significantly contributing to Odisha's economy and India's semiconductor value chain. The plant aims to bolster critical sectors such as AI, defense, and telecommunications, reflecting Odisha's transition into a technology-driven economy. Despite political criticism, the initiative marks a major step towards India's self-reliance in semiconductor manufacturing and integrates the state into the larger national electronic manufacturing narrative.
Why It Matters
This plant positions India as a growing player in the global semiconductor supply chain, reducing dependency on imports and enhancing technological sovereignty.
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